More efficiency in LED modules
With the introduction of Chip on Board LED technology, it has been possible to develop high-power devices with a small light-emitting surface area. COB technology made it possible to miniaturize the fixtures and light sources inside, allowing individual LED diodes to be installed in compact assemblies, thus achieving higher luminous flux and yet ensuring efficient dissipation of the heat produced.
SURFACES FOR THE SECTOR
Solutions for Base Plates for CoB LEDs
To achieve optimal heat management and increase the light output of the LED luminaire,, it is advantageous to mount the LED chips on an aluminum PCB plate with an appropriate PVD coating.
The total reflectance of the vegaLED on Board (VLB) surface is combined with high standards in spectral uniformity, optical performance, and environmental and heat stability.
